Electronics packaging – Incorporating industry standard, state-of-the-art software in the design process, Astro Space will provide an optimum packaging solution for your product, whether it is intended to be on board a satellite orbiting Mars, in a jet fighter, in a hospital operating room, or an industrial control system on a factory floor. Astro Space electronics packaging expertise assures a reliable product in extreme operating conditions of temperature, vibration, and mechanical shock.
CAD Drawing and Modeling – Whether you need to create a custom part for your project, get the drawing to a manufacturer, patent attorney, or to convert your library from 2D to 3D, we will create models to accommodate your specific needs, provide feature editing, 3D product renderings and documentation of components and assemblies.
Mechanical Analyses – Astro Space analyses, fit/tolerance stack-up, motion studies, Stress and Dynamics, Thermal simulation/Analyses, Solder Fatigue, Vibration, and more.
- Mechanical Worst-Case Analysis (WCA), to consider environmental and physical changes such as dust fouling of heat sinks
- Mean Time Between Failure Analysis
- Stress & Dynamics Analyses – analyze potential structural failure points
- Static Load Analysis –to insure structural integrity of components
- Thermal Analysis – analyze thermal parameters of operation, to determine maximum and minimum operating temperatures within an assembly or components.
- Worst Case Analysis — to consider environmental and physical changes such as dust fouling of heat sinks.
- Fatigue – determining failure point or weak link in a design, including Solder Fatigue
- Dimension, Tolerance, and Fit Analyses – Including collision/interference detection
Model Creation & 3D Rendering
